Data Center

Coolant Distribution (CDU)

Coolant distribution is the hydraulic interface between the facility water loop of a data centre and the technology loop inside the rack. A coolant distribution unit keeps both loops physically separate, holds the secondary supply temperature above the dew point of the rack environment, matches flow rate to the heat the servers actually release and keeps system pressure inside the window the cold plates allow. Heat exchanger, circulation pump, pressure maintenance, filtration and instrumentation for temperature, pressure and conductivity all belong to this assembly. Direct-to-chip cooling cannot be run safely without it.

This section currently lists no articles. The branch is structured by function in the cooling loop first, and the range is being built up: distribution units, water-to-water heat exchangers, pump groups, pressure maintenance and spare parts. Until stock arrives, the subcategories set out what each assembly does in the loop and which materials survive in the water-glycol mixture of an IT loop. Requests for specific assemblies are handled as project business.

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Buying guide

How to choose Coolant Distribution (CDU)

What matters when choosing: properties, comparison and typical applications.

What coolant distribution does

⚡ Loop separation - secondary water and facility water stay physically apart, so dirt and hardness do not reach the cold plate
↕ Dew point control - supply temperature is held above the dew point in the rack, so no condensate forms on hoses and manifolds
⚙ Flow follows load - pump and control valve track the released heat instead of a fixed set point
◆ Pressure maintenance - membrane vessel and make-up hold pressure within the range the cold plate seals accept
✓ Material rule of this branch - stainless steel, PP, PE, PVDF, PTFE, POM and PVC are unrestricted, brass, gunmetal, bronze and copper only in single-metal pairings, galvanised steel and aluminium not at all
◎ Range under construction - the subcategories exist and describe the function, articles follow as series are released

Assemblies of the cooling loop compared

Which assembly performs which task in the secondary loop

AssemblyTask in the loopSelection criterionMaterial note
Coolant distribution unitseparates primary and secondary loop, controls temperature and flowheat load, temperature spread, pump redundancywetted parts in stainless steel and plastics
Water-to-water heat exchangertransfers heat between the loopsapproach temperature, pressure drop, cleanabilitystainless steel plates, check the brazing material
Circulation pump and pump groupgenerates the flow rate in the secondary loophead at the duty point, control mode, redundancyhousing in stainless steel or plastics
Expansion vessel and pressure maintenanceabsorbs volume change and holds system pressuresystem volume, temperature swing, static heightmembrane resistant to water-glycol
Spare and wear partsreplace seals, filters and sensorsdevice series, sealing materialEPDM and PTFE are common in glycol loops

Typical applications

  • Direct-to-chip cooling of AI and HPC racks with cold plates
  • Rear door heat exchangers on existing server cabinets
  • Retrofitting air cooled floor space with individual liquid cooled islands
  • Colocation sites where facility loop and customer loop are owned separately
  • Test benches and laboratory loops with a defined supply temperature
  • Secondary loops for power electronics and power supplies inside the rack