IT Cooling Loop (TCS)

Data Center

The IT cooling loop, known in data centre practice as the Technology Cooling System, removes waste heat where it is produced: directly at the processor. It runs as a closed secondary loop, hydraulically separated from the facility loop by a coolant distribution unit. From there the water-glycol mixture travels through row and rack manifolds to the cold plates inside the servers, picks up the dissipated power and returns to the heat exchanger. Because this liquid circulates a few millimetres away from live electronics, joint integrity, drip-free disconnection under pressure and a corrosion-safe material pairing determine the uptime of entire rack rows.

The subcategories of this branch describe what each component does inside the loop; the product range for the IT layer is currently being built up and is not yet listed here. Hose assemblies, couplings and shut-off valves can already be made up from our existing fluid power programme. One material rule applies throughout the closed water-glycol loop: stainless steel and engineering plastics are uncritical, copper alloys only within a single alloy family, galvanised steel and aluminium have no place in this circuit.

Cold Plates and Server Cooling ModulesHeat pickup directly at the processor, fed from rack manifolds
Rack and Row ManifoldsDistributes supply and return flow within rack and row
Rack Connection Kits and Hose SetsAssembled hose sets and couplings between manifold and server
Rear Door Heat ExchangersHeat exchanger in the rack door, recooling the exhaust air
Immersion Cooling and AccessoriesImmersion tanks with dielectric fluid, water-cooled secondary side

⚡ Closed secondary loop - the coolant distribution unit separates IT water from the facility loop, pressure and water quality stay independent
↕ Drip-free disconnection - flat-face couplings keep residual volume and spillage low when a server is swapped
💧 Single alloy family - copper, brass and aluminium in the same loop form a galvanic cell
⚙ Plastics without restriction - PVDF, PP, PE, PTFE, POM and PVC withstand water-glycol permanently
🔧 Freedom from particles - cold plate channels are narrow, wear debris and swarf will block them
✓ Range under construction - components for the IT layer start as made-up assemblies from the fluid power programme

Materials in the closed water-glycol loop of the IT layer

MaterialUse in the IT loopReason
Stainless steelunrestrictedresistant to water-glycol, releases no particles into the loop
PVDF, PP, PEunrestrictedchemically resistant, non-conductive, forms no galvanic cell
PTFE, POM, PVCunrestrictedsuitable for sealing and sliding faces as well as valve components
Brass, gunmetal, bronze, coppersingle alloy family onlymixed with less noble metals the loop develops galvanic corrosion
Galvanised steeldo not usethe zinc layer sheds and the particles block cold plate channels
Aluminiumdo not useleast noble material in the loop, corrodes first against copper parts

  • Racks with direct-to-chip cooling where air can no longer carry away the dissipated power
  • High performance computing and AI training clusters running at sustained load
  • Colocation floors where individual rows are converted to liquid cooling
  • Retrofitting air-cooled legacy rows through heat exchangers in the rack door
  • Test floors and laboratory rigs where server hardware is measured under load
We can't find products matching the selection.