Data Center
The Data Center branch groups the components that carry water and water-glycol from the facility loop to the chip. The path starts in the Facility Water System (FWS) with dry cooler, pump and distribution, runs through the Coolant Distribution Unit (CDU) that hydraulically separates facility side and IT side, and ends in the IT Cooling Loop (TCS) at cold plates, rear-door heat exchangers or immersion tanks. Every disconnect, valve and fitting along that path is filed here: around 45,000 items in 15 sections, from quick disconnects through strainers and flow switches to plate heat exchangers.
The tree is organised by function in the loop, not by manufacturer and not by material. A dry-break disconnect belongs under Couplings and Disconnects, whether it is made by Nitto Kohki, Cejn or Stauff. The three loop-level sections Facility Water System (FWS), Coolant Distribution (CDU) and IT Cooling Loop (TCS) are still being built up: for now they describe what each level does, the product range follows. The same applies to coolants, insulation and labelling.
Categories
All areas for Data Center
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Advantages
Technical benefits
The key technical properties at a glance.
In detail
System comparison & product overview
The key data in table form.
The three loops compared - facility water system, coolant distribution and IT cooling loop
| Criterion | Facility Water System (FWS) | Coolant Distribution (CDU) | IT Cooling Loop (TCS) |
|---|---|---|---|
| Function | Reject waste heat from the building to dry coolers and ambient | Hydraulic separation of both loops, control of pressure and temperature | Pick up heat directly at the rack and at the component |
| Medium | water or water-glycol on the facility side | facility water on the primary side, treated coolant on the secondary side | treated water-glycol mixture in a closed loop |
| Typical components | pumps, dry coolers, shut-off valves, strainers | plate heat exchangers, control valves, instrumentation, filtration | manifolds, hoses, dry-break couplings, seals |
| Materials | steel and stainless steel, common on the facility side | stainless steel and plastics on the secondary side | stainless steel, PVDF, PP, PE, PTFE, POM, PVC; no aluminium, no galvanised steel |
| Status in the catalogue | section being built up | section being built up | section being built up |
| Components already listed under | valves, piping, filtration | measurement and monitoring, valves, filtration | couplings and disconnects, sealing technology, piping |
Overview
Typical applications
Background and details for this range.
- Direct-to-chip cooling with cold plates in AI and HPC racks
- Rear-door heat exchangers and rack-level air handling
- Coolant distribution between facility loop and IT loop, primary and secondary side
- Conversion of existing air-cooled racks to liquid cooling
- First fill, flushing and commissioning of new cooling loops
- Hot-swapping modules through dry-break disconnects
- Test benches and laboratory rigs for cooling components